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INTEGRATED CIRCUITS
DATA SHEET
TDA5051A Home automation modem
Product specification Supersedes data of 1997 Sep 19 File under Integrated Circuits, IC11 1999 May 31
Philips Semiconductors
Product specification
Home automation modem
FEATURES * Full digital carrier generation and shaping * Modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator * High clock rate of 6-bit A/D (Digital to Analog) converter for rejection of aliasing components * Fully integrated output power stage with overload protection * Automatic Gain Control (AGC) at receiver input * 8-bit A/D (Analog to Analog) converter and narrow digital filtering * Digital demodulation delivering baseband data * Easy compliance with EN50065-1 with simple coupling network * Few external components for low cost applications * SO16 plastic package. QUICK REFERENCE DATA SYMBOL VDD IDD(tot) PARAMETER supply voltage total supply current reception mode transmission mode (DATAIN = 0) power-down mode fcr fosc Vo(rms) Vi(rms) THD ZL BR Tamb Notes carrier frequency oscillator frequency output carrier signal on CISPR16 load (RMS value) input signal (RMS value) total harmonic distortion on CISPR16 load with coupling network load impedance baud rate ambient temperature note 2 note 1 ZL = 30 fosc = 8.48 MHz - - - 95 6.08 120 82 - 1 - 0 28 47 19 132.5 8.48 - - -55 30 600 - CONDITIONS MIN. 4.75 TYP. 5.0 APPLICATIONS
TDA5051A
* Home appliance control (air conditioning, shutters, lighting, alarms and so on) * Energy/heating control * Amplitude Shift Keying (ASK) data transmission using the home power network. GENERAL DESCRIPTION The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 or 1200 baud data rate. It operates from a single 5 V supply.
MAX. 5.25 38 68 25 148.5 9.504 122 122 - - 1200 70
UNIT V mA mA mA kHz MHz dBV dBV dB bits/s C
1. Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency. 2. The minimum value can be improved by using an external amplifier, see application diagrams Figs 22 and 23.
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
ORDERING INFORMATION TYPE NUMBER TDA5051AT BLOCK DIAGRAM PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 7.5 mm
TDA5051A
VERSION SOT162-1
handbook, full pagewidth
DGND 5
AGND 12
VDDA 13
VDDD 3 modulated carrier D/A
VDDAP 11
6 ROM
POWER DRIVE WITH PROTECTION
10
TXOUT
DAC clock 10
9
APGND
1 DATAIN
CONTROL LOGIC
TDA5051A
CLKOUT 4 filter clock
15
PD
OSC1
7 OSCILLATOR
OSC2
8
/2
DATAOUT
2
DIGITAL DEMODULATOR
DIGITAL BAND-PASS FILTER 8
14 A/D RXIN 5 H PEAK DETECT L U D U/D COUNT
16
6
MGK832
TEST1 SCANTEST
Fig.1 Block diagram.
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
PINNING SYMBOL DATAIN DATAOUT VDDD CLKOUT DGND SCANTEST OSC1 OSC2 APGND TXOUT VDDAP AGND VDDA RXIN PD TEST1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION digital data input (active LOW) digital data output (active LOW) digital supply voltage clock output digital ground test input (LOW in application) oscillator input oscillator output analog ground for power amplifier analog signal output analog supply voltage for power amplifier analog ground analog supply voltage analog signal input power-down input (active HIGH) test input (HIGH in application)
handbook, halfpage
TDA5051A
DATAIN 1 DATAOUT 2 VDDD 3 CLKOUT 4 DGND 5 SCANTEST 6 OSC1 7 OSC2 8
MGK833
16 TEST1 15 PD 14 RXIN
TDA5051AT
13 VDDA 12 AGND 11 VDDAP 10 TXOUT 9 APGND
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION Both transmission and reception stages are controlled either by the master clock of the microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. The interface with the power network is made by means of an LC network (see Fig.18). The device includes a power output stage that feeds a 120 dBV (RMS) signal on a typical 30 load. To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin CLKOUT. For low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller, see Section "Power-down mode". When the circuit is connected to an external clock generator (see Fig.6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit. Fig.7 shows the use of the on-chip clock circuit.
All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy connection to a standard microcontroller I/O port. The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1, are used for production test: these pins must be left open-circuit in functional mode (correct levels are internally defined by pull-up or pull-down resistors). Transmission mode To provide strict stability with respect to environmental conditions, the carrier frequency is generated by scanning the ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance. The data modulation is applied through pin DATAIN and smoothly applied by specific digital circuits to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN50065-1 recommendations). A -55 dB Total Harmonic Distortion (TDH) is reached when the typical LC coupling network (or an equivalent filter) is used.
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Philips Semiconductors
Product specification
Home automation modem
The DAC and the power stage are set in order to provide a maximum signal level of 122 dBV (RMS) at the output. The output of the power stage (TXOUT) must always be connected to a decoupling capacitor, because of a DC level of 0.5VDD at this pin, which is present even when the device is not transmitting. This pin must also be protected against overvoltage and negative transient signals. The DC level of TXOUT can be used to bias a unipolar transient suppressor, as shown in the application diagram; see Fig.18. Direct connection to the mains is done through an LC network for low-cost applications. However, a HF signal transformer could be used when power-line insulation has to be performed. CAUTION In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to -6 dB as long as DATAIN is LOW. Then, the old gain setting is automatically restored. Reception mode The input signal received by the modem is applied to a wide range input amplifier with AGC (-6 to +30 dB). This is basically for noise performance improvement and signal level adjustment, which ensures a maximum sensitivity of the ADC. An 8-bit conversion is then performed, followed by digital band-pass filtering, to meet the CISPR normalization and to comply with some additional limitations met in current applications.
TDA5051A
After digital demodulation, the baseband data signal is made available after pulse shaping. The signal pin (RXIN) is a high-impedance input which has to be protected and DC decoupled for the same reasons as with pin TXOUT. The high sensitivity (82 dBV) of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling network), which also acts as an anti-aliasing filter for the internal digital processing; see Fig.18. Data format TRANSMISSION MODE The data input (DATAIN) is active LOW: this means that a burst is generated on the line (pin TXOUT) when DATAIN pin is LOW. Pin TXOUT is in a high-impedance state as long as the device is not transmitting. Successive logic 1s are treated in a Non-Return-to-Zero (NRZ) mode, see pulse shapes in Figs 8 and 9. RECEPTION MODE The data output (pin DATAOUT) is active LOW; this means that the data output is LOW when a burst is received. Pin DATAOUT remains LOW as long as a burst is received. Power-down mode Power-down input (pin PD) is active HIGH; this means that the power consumption is minimum when pin PD is HIGH. Now, all functions are disabled, except clock generation.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD fosc Tstg Tamb Tj HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. supply voltage oscillator frequency storage temperature ambient temperature junction temperature PARAMETER 4.5 - -50 -10 - MIN. 12 +150 +80 125 MAX. 5.5 V MHz C C C UNIT
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Philips Semiconductors
Product specification
Home automation modem
CHARACTERISTICS VDDD = VDDA = 5 V 5%; Tamb = 0 to 70 C; VDDD connected to VDDA; DGND connected to AGND. SYMBOL Supply VDD IDD(RX/TX)(tot) IDD(PD)(tot) supply voltage total analog + digital supply current total analog + digital supply current; power amplifier supply current VDD = 5 V 5% TX or RX mode VDD = 5 V 5%; PD = HIGH Power-down mode VDD = 5 V 5%; ZL = 30 ; DATAIN = LOW in transmission mode VDD = 5 V 5%; ZL = 1 ; DATAIN = LOW in transmission mode 4.75 - - 5 28 19 5.25 38 25 PARAMETER CONDITIONS MIN. TYP.
TDA5051A
MAX.
UNIT
V mA mA
IDD(PAMP)
-
19
30
mA
IDD(PAMP)(max) maximum power amplifier supply current
-
76
-
mA
DATAIN and PD inputs: DATAOUT and CLKOUT outputs VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage IOH = -1.6 mA IOL = 1.6 mA 0.2VDD + 0.9 - -0.5 2.4 - - - - VDD + 0.5 - 0.45 V V V 0.2VDD - 0.1 V
OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when using an external clock generator) VIH VIL VOH VOL Clock fosc f osc -------f cr f osc --------------------f CLKOUT oscillator frequency ratio between oscillator and carrier frequency ratio between oscillator and clock output frequency 6.080 - - - 64 9.504 - - MHz HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage IOH = -1.6 mA IOL = 1.6 mA 0.7VDD -0.5 2.4 - - - - - VDD + 0.5 - 0.45 V V V 0.2VDD - 0.1 V
2
Transmission mode fcr tsu th carrier frequency set-up time of the shaped burst hold time of the shaped burst fosc = 8.48 MHz fosc = 8.48 MHz; see Fig.8 fosc = 8.48 MHz; see Fig.8 - - - 132.5 170 170 - - - kHz s s
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
SYMBOL tW(DI)(min) Vo(rms) Io(max) Zo VO THD
PARAMETER minimum pulse width of DATAIN signal output carrier signal (RMS value)
CONDITIONS fosc = 8.48 MHz; see Fig.8 ZL = CISPR16; DATAIN = LOW - 120 - - - Vo(rms) = 121 dBV on CISPR16 load; fosc = 8.48 MHz; DATAIN = LOW (no modulation); see Figs 3 and 16 Vo(rms) = 121 dBV on CISPR16 load; fosc = 8.48 MHz; DATAIN = 300 Hz; duty factor = 50%; see Fig.4 -
MIN.
TYP. 190 - 160 5 2.5 -55 -
MAX.
UNIT s dBV mA V dB
122 - - - -
power amplifier maximum ZL = 1 ; output current (peak value) DATAIN = LOW output impedance of the power amplifier output DC level at pin TXOUT total harmonic distortion on CISPR16 load with the coupling network (measured on the first ten harmonics) bandwidth of the shaped output signal (at -20 dB) on CISPR16 load with the coupling network
B-20dB
-
3000
-
Hz
Reception mode Vi(rms) VI Zi RAGC tc(AGC) td(dem)(su) td(dem)(h) Bdet BER analog input signal (RMS value) DC level at pin RXIN RXIN input impedance AGC range AGC time constant demodulation delay set-up time demodulation delay hold time detection bandwidth bit error rate fosc = 8.48 MHz; see Fig.5 fosc = 8.48 MHz; see Fig.15 fosc = 8.48 MHz; see Fig.15 fosc = 8.48 MHz fosc = 8.48 MHz; 600 baud; S/N = 35 dB; signal 76 dBV; see Fig.17 82 - - - - - - - - - 2.5 50 36 296 350 420 3 1 122 - - - - 400 470 - - dBV V k dB s s s kHz 1 x 10-4
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
SYMBOL Power-up timing td(pu)(TX)
PARAMETER
CONDITIONS - XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 M; see Fig.10 XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 M; fRXIN = 132.5 kHz; 120 dBV sine wave; see Fig.11 -
MIN.
TYP. -
MAX.
UNIT s
delay between power-up and DATAIN in transmission mode delay between power-up and DATAOUT in reception mode
1
td(pu)(RX)
1
-
s
Power-down timing td(pd)(TX) delay between PD = 0 and DATAIN in transmission mode delay between PD = 0 and DATAOUT in reception mode minimum active time with T = 10 ms power-down period in reception mode fosc = 8.48 MHz; see Fig.12 fosc = 8.48 MHz; fRXIN = 132.5 kHz; 120 dBV sine wave; see Fig.13 fosc = 8.48 MHz; fRXIN = 132.5 kHz; 120 dBV sine wave; see Fig.14 - 10 - s
td(pd)(RX)
-
500
-
s
tactive(min)
-
1
-
s
dbook, full pagewidth
0
MGK834
132.5 kHz
Vo(rms) (dBV)
-100 105 Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBV (RMS); marker at -5 dBV (RMS) = 115 dBV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBV (RMS).
f (Hz)
106
Fig.3 Carrier spectrum.
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
1500 Hz -10 handbook, full pagewidth
MBH664
20 dB
dBV (RMS)
-60 117.5
132.5
f (kHz)
147.5
Resolution bandwidth = 100 Hz; B-20dB = 3000 Hz (2 x 1500 Hz).
Fig.4 Shaped signal spectrum.
handbook, full pagewidth
VRXIN
modulated sine wave 122 dBV amplitude
V(I)
0
t
GAGC +30 dB 8.68 dB AGC range -6 dB tc(AGC) (AGC time constant)
MGK011
Fig.5 AGC time constant definition (not to scale).
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Philips Semiconductors
Product specification
Home automation modem
TIMING Configuration for clock
TDA5051A
handbook, full pagewidth
OSC1 CLKOUT XTAL MICROCONTROLLER DGND GND 5
MGK835
fosc
7
TDA5051A
For parameter description, see Table 1.
Fig.6 External clock.
handbook, full pagewidth
CLKIN MICROCONTROLLER GND
CLKOUT
1/2 f osc
4
8
OSC2
C1
TDA5051A
DGND 5 7 OSC1
Rp
XTAL C2
MGK836
For parameter description, see Table 1.
Fig.7 Typical configuration for on-chip clock circuit.
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Philips Semiconductors
Product specification
Home automation modem
Table 1 Clock oscillator parameters CARRIER FREQUENCY fcr 95 to 148.5 kHz CLOCK OUTPUT FREQUENCY 1 f 2 osc 3.040 to 4.752 MHz
TDA5051A
OSCILLATOR FREQUENCY fosc 6.080 to 9.504 MHz
EXTERNAL COMPONENTS C1 = C2 = 27 to 47 pF; Rp = 2.2 to 4.7 M; XTAL = standard quartz crystal
Table 2
Calculation of parameters depending on the clock frequency PARAMETER oscillator frequency CONDITIONS with on-chip oscillator: frequency of the crystal quartz; with external clock: frequency of the signal applied at OSC1
1 1 2fosc 64fosc
SYMBOL fosc
UNIT Hz
fCLKOUT fcr tsu th tW(DI)(min)
clock output frequency carrier frequency/digital filter tuning frequency set-up time of the shaped burst
Hz Hz s
23 1472 ----- or -----------f cr f osc 23 1472 ----- or -----------f cr f osc 1 tsu + ----f cr tW(DI)(min) + th 2514 -----------f osc 3200 ------------ (max.) f osc 3800 ------------ (max.) f osc
hold time of the shaped burst
s
minimum pulse width of DATAIN signal
s
tW(burst)(min) minimum burst time of VO(DC) signal tc(AGC) tsu(demod) th(demod) AGC time constant
s s
demodulation set-up time
s
demodulation hold time
s
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
TXOUT
tW(burst)
tW(burst)(min)
VO(DC)
tsu 0
th
DATAIN
tW(DI)
tW(DI)(min)
(1)
(2)
(3)
MGK837
(1) tW(DI) > tW(DI)(min). 1 (2) tW(DI)(min) = tsu + ----f cr (3) tW(DI)(min) < tsu; wrong operation.
Fig.8 Relationship between DATAIN and TXOUT (see Table 3).
Table 3
Relationship between DATAIN and TXOUT PD 1 0 0 DATAIN X(1) 1 0 TXOUT high-impedance high-impedance (after th) active with DC offset
Note 1. X = don't care.
handbook, halfpage
tW(burst) tsu th
100%
MGK010
Fig.9 Pulse shape characteristics.
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Philips Semiconductors
Product specification
Home automation modem
Timing diagrams
TDA5051A
handbook, full pagewidth
90% VDD
VDD
CLKOUT
NOT DEFINED
CLOCK STABLE
DATAIN
HIGH
TXOUT td(pu)(TX)
MGK015
DATAIN is an edge-sensitive input and must be HIGH before starting a transmission.
Fig.10 Timing diagram during power-up in transmission mode.
handbook, full pagewidth
90% VDD
VDD
CLKOUT
NOT DEFINED
CLOCK STABLE
RXIN
DATAOUT
NOT DEFINED
HIGH td(pu)(RX) td(dem)(h)
MGK016
Fig.11 Timing diagram during power-up in reception mode.
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
PD
DATAIN
TXOUT td(pd)(TX) normal operation wrong operation TXOUT delayed by PD
MGK017
Fig.12 Power-down sequence in transmission mode.
handbook, full pagewidth
PD
RXIN
DATAOUT td(dem)(su) DATAOUT delayed by PD td(pd)(RX) td(pd)(RX)
MGK018
Fig.13 Power-down sequence in reception mode.
handbook, full pagewidth
PD
RXIN
DATAOUT tactive(min) T IDD(RX) IDD IDD(PD) 0
MGK845
Fig.14 Power saving by dynamic control of power-down.
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
TEST INFORMATION
TDA5051A
handbook, full pagewidth
DATAIN pulse generator 300 Hz 50%
1
10
TXOUT
1 F
TDA5051A
DATAOUT (to be tested) 2 7 Y1 Y2 8 30 XTAL fosc 14 RXIN 10 nF
OSCILLOSCOPE
DATAIN
TXOUT/RXIN
DATAOUT
td(dem)(su)
td(dem)(h)
MGK838
Fig.15 Test set-up for measuring demodulation delay.
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
coupling network(3) TXOUT 10 F 33 nF 47 H 47 H
CISPR16 network(4)
OSC1 7
10
250 nF
TDA5051A
8 OSC2 1 DATAIN 12, 5, 9 13, 3, 11 VDDA, VDDD, VDDAP AGND, DGND, APGND
33 nF
50 H 50 5
250 nF
(1) (2)
+5 V POWER SUPPLY 50 H 5 SPECTRUM ANALYSER 50
MGK839
(1) (2) (3) (4)
Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3). DATAIN = LOW for measuring total harmonic distortion (see spectrum Fig.3). Tuned for fcr = 132.5 kHz. The CISPR16 network provides a -6 dB attenuation.
Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal.
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
10
TXOUT
in COUPLING NETWORK (1)
out
+
+
TDA5051A
12, AGND, DGND, APGND 5, 9 OSC2
SPECTRUM ANALYSER 50
1 DATAIN OSC1
7
8
out XTAL = 8.48 MHz WHITE NOISE GENERATOR
OSC1 7 8
OSC2 14 RXIN out COUPLING NETWORK (1) in PARAMETERS 600 BAUD PSEUDO RANDOM SEQUENCE: 29-1 BITS LONG
TDA5051A
(to be tested) 2 DATAOUT DATAIN 12, AGND, DGND, APGND 5, 9
RXD V24/TTL INTERFACE TXD V24 SERIAL DATA ANALYSER
DATAOUT
MGK840
(1) See Fig.16.
Fig.17 Test set-up for measuring Bit Error Rate (BER).
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Philips Semiconductors
Product specification
Home automation modem
APPLICATION INFORMATION
TDA5051A
handbook, full pagewidth
250 V (AC) max
T 630 mA MOV 250 V (AC) 2 F 250 V (AC) 68 (2 W) 47 nF/X2 250 V (AC)
+5 V 1
1 mH
47 nF (63 V)
47 H low RS
78L05
2
3 470 F (16 V)
1N4006
7V5 (1.3 W)
1N4006
47 H
47 nF
100 F (16 V) VDDD VDDAP 11 VDDA 13 14 RXIN 10 nF TXOUT SA5.0A 7 OSC1 2.2 M XTAL 7.3728 MHz 8 5 9 12 OSC2 DGND APGND AGND
1 F (16 V)
+5 V
DATAIN DATAOUT MICROCONTROLLER CLKOUT PD
3 1 2
TDA5051A
4 15 10
27 pF
27 pF
MGK841
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.18 Application diagram without power line insulation.
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
20
MBH907
103
gain (dB) 0 input impedance ()
-20
-40
1
102
-60
2
-80
-100 10
102
103
104
105
106
f (Hz)
10 107
Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (12fosc). Input impedance always higher than 10 within the 95 to 148.5 kHz band.
Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr = 115.2 kHz; L = 47 H; C = 47 nF).
handbook, halfpage
130
MBH908
Vo (dBV) 120
110
100 1 10 Zline ()
102
Fig.20 Output voltage as a function of line impedance (with coupling network; L = 47 H; C = 47 nF).
1999 May 31
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
250 V (AC) max
T 630 mA MOV 250 V (AC) 100 (0.5 W) NEWPORT 76250
470 nF/X2 250 V (AC) 47 H low RS 6 5 100
230 V 1 VA +5 V 1 6V 3 470 F (16 V)
2 1
78L05
2
FDB08 100 nF (63 V) 22 H
47 nF
100 F (16 V) VDDD VDDAP 11 VDDA 13 14 RXIN TXOUT 10 nF
1 F (16 V) 3
+5 V
DATAIN DATAOUT MICROCONTROLLER CLKOUT PD
1 2
TDA5051A
4 15 7 OSC1 2.2 M XTAL 7.3728 MHz 8 5 9 12 10
OSC2 DGND APGND AGND
SA5.0A
27 pF
27 pF
MGK842
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.21 Application diagram with power line insulation.
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
250 V (AC) max
T 630 mA MOV 250 V (AC) 2 F 250 V (AC) 68 (2 W) 47 nF/X2 250 V (AC) 47 H low RS 47 nF (63 V)
+5 V 1
1 mH
78L05
2
3 470 F (16 V)
1N4006
7V5 (1.3 W)
1N4006 47 H
47 nF
100 F (16 V) VDDD VDDAP 11 VDDA 13 14 RXIN 10 nF TXOUT BC547B 1 k 7 OSC1 2.2 M XTAL 7.3728 MHz 8 5 9 12 OSC2 DGND APGND AGND 33 k
1 F (16 V)
+5 V
DATAIN DATAOUT MICROCONTROLLER CLKOUT PD
3 1 2
10 k
150 k 10 nF
TDA5051A
4 15 10
SA5.0A
27 pF
27 pF
MGK843
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBV typ.).
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Philips Semiconductors
Product specification
Home automation modem
TDA5051A
handbook, full pagewidth
250 V (AC) max
T 630 mA MOV 250 V (AC) 100 (0.5 W) NEWPORT 76250
470 nF/X2 250 V (AC) 47 H low RS 6 5 100
230 V 1 VA +5 V 1 6V 3 470 F (16 V)
2 1
78L05
2
FDB08 100 nF (63 V) 22 H
47 nF
100 F (16 V) VDDD VDDAP 11 VDDA 13 14 RXIN 10 nF
1 F (16 V) 3 10 k
+5 V
DATAIN DATAOUT MICROCONTROLLER CLKOUT PD
1 2
150 k 10 nF
TDA5051A
4 15 7 OSC1 2.2 M XTAL 7.3728 MHz 8 5 9 12 10
TXOUT BC547B 1 k 33 k
OSC2 DGND APGND AGND
SA5.0A 27 pF
MGK844
27 pF
fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.
Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBV typ.).
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Philips Semiconductors
Product specification
Home automation modem
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm
TDA5051A
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1999 May 31
23
Philips Semiconductors
Product specification
Home automation modem
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TDA5051A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 May 31
24
Philips Semiconductors
Product specification
Home automation modem
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ not suitable suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes
TDA5051A
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 May 31
25
Philips Semiconductors
Product specification
Home automation modem
NOTES
TDA5051A
1999 May 31
26
Philips Semiconductors
Product specification
Home automation modem
NOTES
TDA5051A
1999 May 31
27
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 65
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
295002/25/02/pp28
Date of release: 1999 May 31
Document order number:
9397 750 05035

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